Verizon NEBS Technical Updates

Introduction

The Verizon NEBS Technical Update section provides the latest information about Verizon's NEBS Compliance programs. This page will present the most current technical information before it is applied to the Checklist and other NEBS Documents.

GR-3108-CORE, Issue 4: Accepted

The release of GR-3108-CORE, Issue 4 has been reviewed and accepted. Current test programs referencing Issue 3 may continue until February 1, 2020. All test programs, thereafter, shall be based on Issue 4.

Prepared by Todd Talbot, DMTS, CORE Systems / Maintenance Engineering – 8/1/19

VZ.TPR.9307 Discontinued

VZ.TPR.9307 Qualification Requirements for Printed Board Assemblies Manufactured with Lead-Free Solder for use in Telecommunications Equipment is no longer required for equipment deployed in the Verizon network. Leaded solder is still preferred but PB-free solder will also be accepted without further evaluation.

Prepared by Todd Talbot, DMTS, Verizon – 5/5/17

GR-3108-CORE, Issue 3: Accepted

The recent release of GR-3108-CORE, Issue 3 has been reviewed and accepted.

Current test programs referencing VZ.TPR.9305 may continue until November 31, 2013. All test programs, thereafter, shall be based on GR-3108-CORE Issue 3.

Prepared by Todd Talbot, DMTS, Verizon Equipment Compliance and Quality Assurance - 5/15/2013

GR-63-CORE, Issue 5: Accepted

The release of GR-63-CORE, Issue 5 was reviewed and accepted at the time of release in December 2017. All test programs should be based on Issue 5.
Prepared by Todd Talbot, DMTS, CORE Systems / Maintenance Engineering – 9/4/19

GR-1089-CORE, Issue 7:

The recent release of GR-1089-CORE, Issue 7 has been reviewed and accepted:

Current test programs referencing Issue 6 may continue until June 30, 2018. All test programs, thereafter, shall be based on Issue 7.

Prepared by Todd Talbot, DMTS, Maintenance Engineering - 1/16/18

GR-1089-CORE, Issue 6: Accepted with Exceptions

The recent release of GR-1089-CORE, Issue 6 has been reviewed and accepted with the following exception:

Sec 4 Lightning and Power Fault – AC Power Fault testing specified at 425 Vrms in Tables 4-4 and 4-5 shall be performed at the GR-1089 Issue 5 levels of 600 Vrms

Current test programs referencing Issue 5 may continue until January 1, 2012. All test programs, thereafter, shall be based on Issue 6.

Prepared by Tony Ali, DMTS, Verizon NEBS, Fiber and Energy Efficiency - 8/1/2011

VZ.TPR.9305 Flame Spread Clarification
Verizon has removed the requirement for using radiometers on either side of the EUT during the flame spread test. As of the effective date below, the flame spread test can be conducted without the need for collecting radiometer data.

Prepared by: Todd Talbot, DMTS, Verizon NEBS, Fiber and Energy Efficiency - 5/3/2011

GR-63-CORE, Flame Spread Clarification

For flame tests involving vertically oriented circuit boards, the methane line burner shall remain lit for a minimum of 180 seconds from the start of the test. At 180 seconds, the methane flow is approximately ½ the maximum flow rate of the profile. If the methane burner does not remain lit during this time period, stop the test and restart the test from the beginning with the fans powered off for the duration of the test.

Flame tests involving horizontally oriented circuit boards shall be performed per the GR procedure. If the methane line burner will not remain lit at the 5 lpm flow rate, restart the test from the beginning with the fans powered off for the duration of the test.

Prepared by: Todd Talbot, DMTS, Verizon NEBS Compliance & Quality Assurance - 11/17/2010

***Verizon waives the Fan Filter requirement (GR-63-CORE, R4-87) for 1U tall products***

Prepared by Todd Talbot, DMTS, Verizon NEBS Compliance and Quality Assurance - 9/16/2010

VZ.TPR.9211 , Vendor Power and Grounding Questionnaire, has been released to the industry. This TPR mandates the collection of data related to power fusing and operation. The data collected from this TPR shall be provided with all other NEBS documentation submitted for review.

Prepared by Todd Talbot, DMTS, Verizon NEBS Compliance and Quality Assurance - 1/29/2010

VZ.TPR.9307 , Qualification Requirements for Printed Board Assemblies Manufactured with Lead-Free Solder for use in Telecommunications Equipment Released to Industry.

This was released to the industry at the 15th Annual NEBS Conference on October 27. This TPR provides the requirements for products that are manufactured with Lead-Free solder. VZ.TPR.9307 has an effective date of June 1, 2010, at which time all products supplied to Verizon with Lead-Free solder shall meet the requirements outlined in the document.

Prepared by Todd Talbot, DMTS, Verizon NEBS Compliance and Quality Assurance - 12/03/2009

GR-487-CORE, Issue 3: Accepted with Exceptions

The recent release of GR-487-CORE, Issue 3 has been reviewed and accepted with the following six (6) exceptions:

1. Requirement R3-4[4]: Statement 'Conformance is to be determined by supplier attestation' is not acceptable. Conformance will be determined by Verizon based on supplier provided data.

2. Requirements R3-6[6] and R3-7[7] are to remain as requirements.

3. Conditional Requirement CR3-112[87] (previously R3-100[87]) is to remain a requirement.

4. Issue 2 requirement R3-106[90] for UL rated weatherproof transfer switch is to remain as a requirement

5. Requirement R3-122[95] (previously R3-111[95]) is to remain in effect.

6. Requirement R3-137[103] (previously R3-126[103]) must also apply to Class 4 (OSP: -40C to +46C) equipment.

Current test programs referencing Issue 2 may continue without upgrade until March 31, 2010. All test programs, thereafter, shall be based on Issue 3.

Prepared by Tony Ali, DMTS, Verizon NEBS Compliance & Quality Assurance - 10/23/2009

GR-1089 – ESD Warning Labels

Electronic components are susceptible, and therefore sensitive, to ESD effects. Regardless of immunity performance during testing, products shall have ESD warning labels permanently affixed to the front of the chassis, in a visible area on the assembly. If cards can be inserted into both the front and rear of the chassis, ESD warning labels shall be placed on both the front and the rear of the chassis assembly. The faceplate of individual circuit cards/modules need not be labeled.

Prepared by: Todd Talbot, DMTS, Verizon NEBS Compliance & Quality Assurance - 10/2/2009

ATCA Standards:

Verizon takes exception to the slot-powering scheme defined by the Advanced Telecom Computing Architecture (ATCA) standards. The power allocated to each slot - 200 Watts per slot or up to 3200 Watts per shelf - is excessive and leads to high failure rates during NEBS testing. Conformance to NEBS requirements is a gating criterion for product approval. We evaluate each product on its merit and select the most cost effective solution to satisfy Verizon's business needs. NEBS compliance testing remains the only set of requirements that Verizon uses to evaluate products for safety, interference and functionality before deployment. For more information about Verizon's NEBS requirements, please download a copy of the TCG NEBS Compliance Checklist from this webpage.

Prepared by: Todd Talbot, DMTS, Verizon NEBS Compliance & Quality Assurance - 3/29/2007

Use of Externally Mounted Ferrites - 5/4/2005

Verizon does not accept the use of externally mounted ferrites on metallic cable interfaces for the purpose of EMI compliance. If used, ferrites shall form part of the products, not the cable, and shall be placed within the chassis enclosure.

Prepared by: Todd Talbot, DMTS, Verizon NEBS Compliance & Quality Assurance - 5/4/2005